SFT's MP100 - vertical PCB plater

MP100 vertical plating advantage:

Continuous processing provides for significantly greater plating distribution and thickness deviations of as little as 5% from front to back and across panel”s surface.

Features:

• Repeatable process parameters for extremely low part-to-part variations
• Low profile vertical conveyor clips facilitate the moving cathode connection and reduce ventilation requirements by creating a virtually sealed process system
• Adjustable cell configuration enables optimum plating process performance
• Process controls for full panel or pattern plating featuring: custom graphical interfaces, data logging, recipe programming and other SPC requirements.