Semiconductor Plating Services

At the Anaheim, CA facility, Technic offers a complete lab service for contract semiconductor plating, using Technic's proprietary SEMCON 2000 chemistry and equipment. The lab can be contracted to perform plating experiments, DOE and prototype plating of 50mm-200mm wafers.

For further information contact the Anaheim office (Tel. 714-632-0200 ext 227) or email Chuck Hirbour.

SEMCON 2000 manual plating bench

Semiconductor Plating Processes
Flip Chip Metallurgy Techni Copper Wafer plating process (experimental) Copper process - PC5000 VP (experimental) Techni Nickel Sulfamate S Techni HT (Hi Throw) Ni Sulfate Technic ECF 61/63 (Arsenic & Thallium Grain Refiners) Techni Gold 25 E (Type III /A Non Cyanide/All Organic additives) ACR 434 Pure Gold (Type III /A,complex cn formula) Techni Matte Tin Sulfate 89T (For use with ACR 434 to plate 80/20 AuSn) Techni-Solder NF Process 820 HS (60/40; 5/95; Pure Sn) Pb Free processes (experimental) UBM (Under bump Metallurgy)

Semiconductor Plating Processes

Flip Chip Metallurgy
Techni Copper Wafer plating process (experimental)
Copper process - PC5000 VP (experimental)
Techni Nickel Sulfamate S
Techni HT (Hi Throw) Ni Sulfate
Technic ECF 61/63 (Arsenic & Thallium Grain Refiners)
Techni Gold 25 E (Type III /A Non Cyanide/All Organic additives)
ACR 434 Pure Gold (Type III /A,complex cn formula)
Techni Matte Tin Sulfate 89T (For use with ACR 434 to plate 80/20 AuSn)
Techni-Solder NF Process 820 HS (60/40; 5/95; Pure Sn)
Pb Free processes (experimental)
UBM (Under bump Metallurgy)