Semiconductor Metallization Chemistry

Process	Products / Applications
Copper	Techni Copper PC2300/3300 Wafer Plating Process (Heavy deposition, bump, post, column, high build MEMS) Copper Process - WA30 (Damascene / low deposition copper) Technic RTA - Real Time Analyzer (Monitor all components of the Technic Copper process)
Nickel	Techni Nickel S (Conventional sulfamate nickel for low stress deposits) Technic HT (Hi throw) NI Sulfate (For fine features, blind vias, trench work)
Gold	Techni Gold 25 ES (pH 6.8, neutral sulfite gold, fine grain deposit, organic grain refiners) ACR 434 (Type III pure soft gold based on CN complex) Technic ECF 61/63 (pH 9.5 metallic grain refiners)
Gold Tin Alloy	AuroStan H (deposits semi-bright to bright eutectic Gold Tin alloy)
Tin	Techni Matte Tin Sulfate 89T (For use with ACR 434 to plate 80/20 AuSn via a duplex process) Technistan Pure Tin WBP (Pb free EP, tin bump) Techni NuSolder JM-6000 WBP (Tin-lead plating process for wafer bump applications, with wide current density range, based on mixed acid technology; compositions available: 1%-100% tin, balance lead.)
Silver	Techni Cyless Silver II (Silver bump application)
UBM	Under Bump Metallurgy - full electroless system (Including Acid Zincate, EN, non CN Au)