In the manufacture of printed circuit boards, the processes related to making the drilled through-holes conductive involve a number of chemical process steps. Specific process and product selections are based on the type of printed circuit boards the fabrication facility is manufacturing. The typical sequence for double-sided printed circuit boards, or plated through-hole innerlayers involves a section of a metallization process sequence. For multilayer printed circuit boards, additional steps are needed to clean the drilled hole wall, remove drill smear from the innerlayer posts and provide adequate topography on the dielectric surface to facilitate adhesion of the subsequent plated metals. In many cases, only one process sequence is established for a variety of printed circuit board types to minimize processing variation and reduce equipment requirements.
Process and product selection for through-hole metallization involves a number of considerations. The primary considerations are:
Technic Inc. offers a wide range of products and processes designed to address the Through-Hole Metallization considerations for all printed circuit board types, dielectric material sets and equipment tools sets. Pre-installation audits are performed to ensure that the products selected meet functional objectives and engineering constraints. Technical assistance including consultations on new equipment designs or equipment modifications is available through the Technic Equipment Division. All Technic products and services are designed and manufactured to meet the highest quality and reliability standards
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