Liquid Coverlay for Flexible Circuits
TechniFlex LCL 1000F, is a liquid photo-imageable coverlay/solder mask for flexible circuits. TechniFlex LCL 1000F is a RoHS compliant, halogen free material that passes UL 94V-0 and NASA outgassing specifications, easily meeting the most stringent OEM requirements. TechniFlex LCL 1000F is compatible with all final finishes, produces excellent adhesion on copper or polyimide , and is capable of the 2mil resolution required by advanced technology applications. The flexibility, superior adhesion to polyimide, and resolution of the TechniFlex LCL 1000F makes it a cost-effective alternative to conventional coverlay films and an answer for the fine pitch requirements of today’s leading edge flexible circuits. TechniFlex LCL 1000F meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078 and MIL P55110D specifications.
- Flexibility: No cracking after 180° bend 10,000 times 1/16” mandrel, 25 times on 1/32” mandrel.
- Flammability: Meets UL94VO with self extinguishing properties
- NASA Outgassing: Passes MICRO VCM TEST/ASTM E-595-93
- Resolution: Excellent side wall for coverlay defined features, 1 mil clearance with 2 mil dams.
- Soldering Resistance: No peeling, blistering, or whitting after 3x10 second float on 258°C eutectic solder with no clean flux and 3 x10 second dip in molten eutectic solder @ 258°C with HASL flux.
