Innerlayer Surface Preparation
The Technic Total Innerlayer Process Solutions begin with copper surface preparation. Utilizing a single step, combination cleaner and microetching technology, the INCIDE H-99 solution offers the shortest process cycle with the smallest footprint. INCIDE H-99 delivers the highest reliability for innerlayer cleaning and preparation for photoimaging.
Single Step Process - INCIDE H-99
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 INCIDE H-99 etched HTE Foil |
A combined acidic cleaner and peroxide based microetch, this single step product cleans the copper surfaces by removing handling soils and oxides. INCIDE H-99 simultaneously etches the copper to provide a significant increase in the surface topography insuring excellent resist adhesion. Ideally suited for thin innerlayer products, plated through-hole innerlayers, flexible substrates and HTE foils, the INCIDE H-99 provides the optimum surface for ultimate resist bonding. The right surface treatment will improve yields, reducing resist lifting and open circuits. INCIDE H-99 will not discolor the copper; i.e. no negative impact on AOI inspection. In standard operations the INCIDE H-99 process is controlled by an in-line process controller. This results in a consistent and uniformly etched copper surface, producing excellent topography without damaging or stretching thin and flexible innerlayer material.
