Innerlayer Process Overview

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Innerlayer Manufacturing Cycle

Begin with Copper Clad Laminate Material
 
Prepare Copper for Imaging by Cleaning and Microetching
Apply Liquid Photo- imageable Resist and Tack Dry
Expose Resist to Generate an Image
 
Develop Pattern, Etch Copper and Strip Resist
AOL / Inspection of Completed Innerlayer
 

Technic Total Process Solutions

Technic Surface Treatment Processes are used to clean and remove oxides, oils, handling soils and any anti-tarnish or conversion coating from the copper surfaces. Specialized cleaners and microetchants increase the surface topography of the copper to improve resist bonding and increase process yields.
 
 
The Technic TechniMask ER-N is a liquid photoimageable etch resist developed specifically for the manufacture of fine line innerlayer product. The TechniMask ER-N can generate circuit traces less than 30 microns in width. This process is production proven in high volume application utilizing roller coating techniques for resist application.
 
 
 
Technic Developers and Resist Strippers are formulated to work with both dry film and liquid resists. Using the Technic Imaging Package provides optimum process performance and cost. A variety of products are available to meet the equipment and waste treatment requirements of your manufacturing site. Recycling techniques are available for Technic products to reduce waste.
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Technic Total Process Solutions