TechniEtch ER-N is a liquid photoimageable etch resists that offers exceptional resolution characteristics. It has a high photosensitivity (80-150mj/cm2 on resist), high-resolution capabilities (30µm/30µm: in a 11µm dried thickness resist film), excellent color contrast after exposure and dries tack-free and ready for stacking. The surface after tack dry is scratch resistant and aides in the elimination of yield loss resulting from handling. TechniEtch ER-N is a cost effective alternative to dry film. The current systems for exposure, developing, etching and stripping, used by many PWB manufacturing operations today for dry film, are compatible with the TechniEtch ER-N process. The TechniEtch ER-N can be coated using a variety of coating methods. The TechniEtch ER-N RV is designed for vertical roller-coating application. TechniEtch ER-N RH is designed for horizontal roller-coating applications and TechniEtch ER-N SC is designed for screen printing application.
| Standard Process Cycle | |
| Pretreatment | Chemical Surface Preparation - INCIDE H-99 Mechanical brushing Pumice & Al2O3 cleaning |
| Coating | Roll coater, Curtain coater, Spin coaterThickness: 9 ~12µm/dry Standard thickness: 10 µm |
| Drying | TechniEtch ER-N RV: Hot air 100ºC x 10-20 min. TechniEtch ER-N RH: Hot air 100ºC x 5~10 min. TechniEtch ER-N SC: Hot air 75-100ºC x 10-20 min. Far-IR 120ºC x 2-5 min |
| Cooling | Air cooling or forced cooling |
| Exposure | 80~150 mj/cm2 (Collimated) |
| Developing | DEVTECH 1200 0.8-1.2%Na2CO3 (aq) @ 28~35ºC 40~60 sec. |
| Etching | CuCl2 or FeCl2 /HCl (aq) |
| Stripping | Technic Resist Stripper 2-5% NaOH (aq) @ 43~53ºC 60~90 sec Spray pressure: 15-43psi |

Overview | Precious Metals | Non-Precious Metals | Pretreatment | Specialty | PWB | Semiconductor | Solar