| CUPROLITE H86/1 |
CUPROLITE H 86/1 is an acid cleaner for copper surfaces that can be used either by spray, flood or by immersion. CUPROLITE H 86/1 rapidly removes fingerprints and oxides from the boards' surface. CUPROLITE H 86/1 leaves the copper surface uniformly wetted, facilitating uniform micro etching. CUPROLITE H 86/1 does not contain complexing agents and does not attack the copper surfaces. CUPROLITE H 86/1 is easily rinsable, guarantees a very high yield and does not require frequent analysis.
| OPERATING CONDITIONS | |
|---|---|
| Temperature: | 115 - 120°F (45-50° C) |
| Treatment time: | 4 - 5 minutes by immersion 0.5 - 1 minute by spray or flood |
| Application: | by spray, flood or immersion |
