| Techni CU 85 |
Techni Cu 85 is used to deoxidize and/or activate copper based parts prior to electroplating. This material is formulated to provide a bright, clean and etched surface on the copper based substrate.
| OPERATING CONDITIONS | |
|---|---|
| Temperature: | 70 - 90°F |
| Time: | 15 seconds to 2 minutes |
| pH: | 0.6 - 1.8 |
| ETCH RATE: (at 1 lb./gal. Techni Cu 85) | |
|---|---|
| 70°F | 25 microinch/minute |
| 80°F | 30 microinch/minute |
| 90°F | 35 microinch/minute |
| 100°F | 40 microinch/minute |
| 110°F | 45 microinch/minute |
