Cleaners and Microetches

Proper cleaning of the copper surfaces prior to imaging is a critical component of success. Technic has developed a number of different cleaning approaches that allow for the maximum process flexibility. Depending on the fabrication process and available equipment, Technic can supply acid or alkaline cleaning solutions and peroxide or persulfate type microetches. Technic cleaners have been designed to remove handling soils, light oils, oxides and conversion coating, both organic and chromate based. The microetching solutions have high metal capacity and generate excellent topography for use in no-scrub applications, increasing popular with thin laminates and flexible substrate. Outlined below are the products most commonly used in innerlayer applications.

1. CUPROLITE H-930 - Acid cleaner for spray or immersion applications. Removes finger prints, oxides and handling soils. Free rinsing.
2. CUPROLITE H 86/1 - Acid cleaner for spray applications. Removes light handling soils and oxides. Free rinsing.
3. NICLAGI 84 - Alkaline cleaner / degreaser. Can be used in immersion or spray applications. Will remove resist residues and other handling soils.
4. TECHNI X-CELL 318 - Acid cleaner for immersion applications. Removes light handling soils and oxides. Free rinsing.
5. MICROINCIDE PHP - Peroxide / sulfuric acid base microetch for copper surfaces.
6. TECHNI CU 85 - Stabilized persulfate type microetch that provides improved etch rate consistency and higher Cu capacity compared to generic materials.

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