Planar Solderable Immersion Tin

LEVELTECH is an immersion tin process with a metallic grain refiner that promotes solderability and inhibits whisker growth associated with pure tin deposits. LEVELTECH can be used in either immersion or flood conveyor applications.

LEVELTECH is a direct alternative to HASL and ENIG; it deposits a thickness of between 0.7 and 1 micron of planar tin. The deposit is ideal for subsequent soldering and will withstand up to three thermal cycles. The unique metallic additive helps to product a dense, fine crystalline deposit and reduces the possibility of whiskering.

LEVELTECH is the ideal process for surface mount and press fit assembly applications. LEVELTECH is suitable for in a lead free assembly environment.