Immersion Silver - Argentomerse NC
Immersion silver is becoming one of the major RoHS and WEEE compliant final finishes for PCB applications. It provides the low cost and ease of operation of OSP but with the solderability of ENIG that’s required for lead free soldering.
Unlike most immersion silvers on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 millionths) of silver/minute on copper and copper alloys. The process utilizes a unique combination of chemistry that provides benefits to both the fabricator and assembler.
| NITRATE FREE: No sensitivity to light and reduced attack on copper substrate. SLIGHTLY ALKALINE: Unlike acid processes the deposition of silver from Argentomerse NC is controlled, yielding more uniform silver thicknesses over a wide range of PCB designs. METALLIC POST DIP: Argentomerse NC Process creates a metallic alloy on the surface that will provide 12 months of shelf life. Most other processes require organics to maintain solderability, which must be removed during the soldering operation. EXCELLENT TOLERANCE TO CHLORIDE: Hundreds of PPM of chloride will not effect the Argentomerse NC process. Argentomerse NC does not require a pre-dip or DI water rinsing prior to the Immersion silver bath. |
  
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Argentomerse NC is the next generation of immersion silver processes. It utilizes a unique chemical system that is easy to operate while providing a consistent surface for lead free soldering.
