Electroless Nickel and Immersion Gold

The TECHNIPAD SMT System is an improved electroless nickel / immersion gold (ENIG) process that has been specifically developed to meet the challenges of selective plating of printed circuit board features. The TECHNIPAD SMT System incorporates a mid-phosphorous electroless nickel (8 — 10% w/w) with a replenishable, non-porous immersion gold. The TECHNIPAD SMT System meets all the requirements for solderability and wire bondability applicable to a thin (3-8 m”) gold deposits.

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