TECHNI Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards required to meet the demands of high aspect ratio boards today.
The OROSENE product line of Gold plating solutions are high speed, high efficiency formulations that minimize hydrogen evolution resulting in improved adhesion of the dry film resist. The OROSENE product line has a stable and controllable electrolyte designed to produce a deposit with consistent physical and functional performance.
Technic 434 HS Acid Pure Gold has been designed to produce a gold deposit that has 99.99+ purity. The deposit meets Mil-G-45204C, Type III, Grade A requirements. The 434 HS is ideally suited to meet the pure soft gold requirements of gold wiring bonding.
Technic supplies a wide range of plating processes for Tin, Tin-Lead and other alloyed metals. For printed circuit board applications the Techni Matte Tin Sulfate 89 T provides excellent etch resist characteristics in a low cost acid sulfate process. For more demanding designs the Techni NF Brite is an MSA tin plating bath that provides improved distribution.
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