Electrolytic Nickel & Gold

TECHNI Nickel HT-2
OROSTRIKE C
OROSENE 990 HS
TECHNIC 434 HS

TECHNI Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to hole distribution and is ideally suited for use in printed wiring board applications where an increased thickness is desired inside a blind via or high aspect ratio through hole. The TECHNI Nickel HT-2 process deposits a low stress nickel barrier layer with excellent cosmetic and mechanical properties.

OROSTRIKE C insures excellent adhesion of the gold to the underlying nickel deposit when a gold strike is required. OROSTRIKE C is an acid gold strike chemistry that has been designed to resist metallic and organic contamination.

OROSENE 990 HS is a high speed, high efficiency hard gold formulation that mini- mizes hydrogen evolution and provides improved edge adhesion on dry film resists. It has a stable and controllable electrolyte designed to produce a deposit with consistent physical and functional performance. OROSENE 990 HS provides improved gold distribution, reducing operating costs. The formulation demonstrates exceptional compatibly with a wide variety of aqueous dry film photo resists. OROSENE 990 HS has been engineered to provide a wide operating window for pattern plating of hard gold. The overall process will provide optimum metal distribution and adhesion while virtually eliminating attack on dry film resist. OROSENE 990 HS has demonstrated high efficiency and a high build rate while maintaining consistent deposit thickness. It can operate at elevated current densities to increase plating speed and will maintain excellent metal distribution over a wide range of metal concentrations and current densities. OROSENE 990 HS is operated at 0.5 - 1.0 tr. oz./gallon and at a current density of 10 ? 15 ASF. The current efficiency, depending on agitation, will range from 55 - 60 % at these metal levels and current densities.

TECHNIC 434 HS is ideally suited to meet the pure soft gold requirements of wire bonding. TECHNIC 434 HS Acid Pure Gold has been designed to produce a gold deposit that has 99.99+ % purity. The deposit meets Mil-G-45204C, Type III, Grade A requirements. TECHNIC 434 HS is operated at 1 tr. oz. / gallon nominal, and will plate bright in a range of 1-10 ASF at 145 - 155 ° F. . The typical operation at 3 ASF with a plating time of 12- 14 minutes will deposit 2.5 microns. The TECHNIC 434 HS deposit is 99.99+ % pure, with a hardness of 80 - 90 Knoop 25. The contact resistance is 0.3 milliohms/cm2. The gold deposit density is 18.5 g/cc.