Electrolytic Acid Copper Technology

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Technic offers a selection of Acid Copper products for printed circuit board applications. Selection of an Electrolytic Acid Copper depends on the board design, the type of plating cell being used and specific performance requirement. Technic technical specialists work with our customers to provide the Electrolytic Acid Copper technology necessary to assure superior process performance.

TECHNIC CU 2300
TECHNIC CU 2800 View Bulletin (PDF format)
TECHNIC CU 3300
TechniPulse 5300
TECHNIC PC-65
TECHNI PC-75

TECHNIC CU 2300 is a unique acid copper plating process specifically designed to meet the demands of today’s complex printed circuit board designs. It operates over a wide current density range, enabling either low current density processing for improved distribution, or higher current densities that increase productivity. The TECHNIC CU 2300 process has excellent throwing power and produces a uniform deposit with good ductility and a fine-grained equiaxed structure. The excellent elongation characteristics of this product make it ideally suited for flex applications or in other applications where mechanical stress resistance is critical. The copper deposited from the TECHNIC CU 2300 process meets all military, IPC and specific OEM requirements for purity, elongation, thermal cycle and thermal shock resistance. The TECHNIC CU 2300 acid copper process is a two component make-up with a typical one component replenishment system that simplifies amp-hour based replenishment. The TECHNIC CU 2300 process is fully analyzable and can be replenished based on actual bath consumption of the individual components by using the patented Real Time Analyzer (RTA), exclusively from Technic.

TECHNIC CU 2800 is a truly unique acid copper plating process specifically designed to meet the demands of today’s complex printed circuit board designs. Providing excellent throwing power over a wide current density range.
TECHNIC CU 2800 offers specific advantages in:

Low current density processing for improved distribution on demanding designs
Increased production capacity on standard product

The superior throwing power of TECHNIC CU 2800 results in uniform deposits with good ductility and a fine-grained equiaxed structure. The process utilizes a one-component system for amp-hour based replenishment. Individual components are available for optimization of specific applications. The additive system is extremely stable and completely analyzable.

SUPERIOR LEVELING
The brightener molecule, designed and manufactured by Technic, provides both grain refinement and leveling of the deposit. Unlike other systems that utilize high levels of sulfur bearing additives to level rough topography, TECHNIC CU 2800 provides leveling without a third component that can negatively effect deposit performance.

THERMAL SHOCK RESULTS
The excellent elongation characteristics of this additive system make it ideally suited where mechanical stress resistance is critical. The copper deposited from the TECHNIC CU 2800 process meets all military, IPC and specific OEM requirements for purity, elongation, thermal cycle and thermal shock resistance.

EXCELLENT THROWING POWER
The TECHNIC CU 2800 acid copper was specifically engineered to provide high throw without the high cost of PPR rectification. The result is the capability of plating a higher current density than standard acid copper while achieving equivalent or higher copper deposit in the through hole. This can mean 25 microns (1 mil) in the center of the hole in 10-20% less time.

CONTROLS
The TECHNIC CU 2800 process is fully analyzable and can be monitored and replenished based on actual bath consumption of the individual components by using Technic’s patented EB Analyzer. This easy to use monitoring system analyzes the copper, sulfuric acid, and the two TECHNIC CU 2800 components, Carrier and Brightener, offering complete control for the components of the acid copper process. This level of control results in improved plating performance and ensures process consistency.

TECHNIC CU 3300 is a unique acid copper plating processes designed for improved distribution in DC applications. It incorporates a high current density polarizer and a macro leveler to enhance low current density deposition. Designed for specialty applications and situations where improved throwing power is required with DC rectification, the TECHNIC CU 3300 can fill small through-holes or blind vias with copper enhancing thermal conductivity in via plug applications without additional processing steps. The TECHNIC CU 3300 process has excellent throwing power and produces a uniform deposit with good ductility and a fine-grained equiaxed structure. The excellent elongation characteristics of this product make it ideally suited for flex applications or in other applications where mechanical stress resistance is critical. The copper deposited from the TECHNIC CU 3300 process meets all military, IPC and specific OEM requirements for purity, elongation, thermal cycle and thermal shock resistance. The TECHNIC CU 3300 acid copper process is a three-component make-up with typically a two-component replenishment that simplifies amp-hour based replenishment.

TechniPulse 5300 has been specifically engineered for pulse periodic reverse or complex pulse wave applications. Our evaluations with major rectifier supplier have been successful. Our current customer bas have both PE and DRPP rectifiers installed. In the pulse mode the TechniPulse 5300 will produce an even, semi-bright deposit from a stable electrolyte. TechniPulse 5300 can also be operated in the DC mode so that a single process can be utilized for both DC and pulse applications. The TechniPulse 5300 is economical to use. The TechniPulse 5300 deposit is a high purity fine grained, equiaxed copper. The copper process exhibits excellent over-plating and soldering properties. The additives are flexible enough to work with airless (E-ductors) and standard conventional DC/Pulse plating tank configurations. The two-component replenishment package is ease to control and can be fully analyzed and replenished utilizing the RTA control tool.

The TechniPulse 5300 Copper has the following benefits:

Specifically engineered to allow for DC and PPR plating utilizing the same additives and operating conditions
In all applications, optimized to produce bright, uniform and ductile deposits from a stable electrolyte
Flexible operation, for use with air or eductor systems, producing excellent distribution characteristics with a wide tank configuration variation
Significantly shorten plating times, shortening cycle time, while maintaining excellent deposit characteristics
Enhanced throw in high aspect ratio plated through holes with improved distribution ratios. There is also a decreased in average circuit height that reduces solder mask usage
Fully analyzable additive system, can be analyzed and controlled by RTA

TECHNIC PC-65 is a bright, acid copper plating process designed to meet the specific needs of the printed circuit industry. The TECHNIC PC-65 process has excellent throwing power, producing a level deposit with good ductility and a fine-grained equiaxed structure. The copper deposits obtained from the TECHNIC PC-65 process meet all military, IPC and specific OEM requirements for purity, elongation and thermal cycle and shock resistance. The TECHNIC PC-65 acid copper system is composed of a make-up brightener and a replenishment additive for simple operation. The installation of TECHNIC PC-65 is simple and cost effective. In most cases the TECHNIC PC-65 additive can be simply added to existing acid coppers products without the need for expensive carbon treatment or new electrolytes. TECHNIC PC-65 operates over a wide current density range, enabling either low current density processing for improved distribution, or higher current densities that increase productivity. The TECHNIC PC-65 process does not require a break-in period prior to use. However, in the case of a new bath with new or thoroughly cleaned anodes, dummy plating is recommended to build a continuous anode film prior to production use.

TECHNI PC-75 has all the above noted performance characteristics and is supplied as a two component replenishment system that allows for the individual control of the Brightener and Carrier additives. The TECHNI PC-75 is ideally suited for use with the Real Time Analyzer (RTA) electrolytic copper analyzer and control system.