Cleaning and Microetching Solutions

In a standard pattern plate process the printed circuit boards are cleaned after the dry film has been applied and imaged. In most cases these printed circuit boards have been previously treated with electroless copper or a direct metallization process, and they require only a mild cleaner and / or etch to remove finger prints, oxides, handling soils and dry film resist residues. Technic has products that are suitable for standard vertical rack processing, horizontal or continuous vertical processing and reel to reel equipment.
Cleaners
Microetches

Cleaners

CUPROLITE H 930 Concentrate is a chloride based multipurpose immersion cleaner for PCBs that can be used in a number of processes in the PCB facility. It is supplied in a concentrate liquid to reduce make up volumes required, minimize shipping costs and reduce inventory. It is suitable for PATTERN-PLATING on boards treated with electroless copper. CUPROLITE H 930 Concentrate rapidly removes fingerprints and oxides from the board’s surface and it also removes the dry-film processing residues, if any. The copper surface is left uniformly wettable for a good micro-etching assuring a good copper-to-copper adhesion. CUPROLITE H 930 Concentrate is easily rinseable and guarantees a very high process yield, suitable for both immersion and spray application.

Techni X-CELL 318 is a liquid acidic cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper alloys. Techni X-CELL 318 can additionally be used either in soak applications or electrolytically. The balanced blend of surfactants not only provides more effective soil removal, but allows for an easily rinsed surface as well. Techni X-CELL 318 is compatible with most dry films and screening resists.

TechniClean AT-1000 has been designed to effectively remove oxides, organic contaminants and resist residues from the copper surfaces. It is a sulfate-based chemistry that enhances the overall compatibility of the cleaner in the Acid Copper plating process. TechniClean AT-1000 is low foaming and suitable for use in flood equipment. It will not etch the copper, making it an ideal cleaner for low build electroless copper cleaning applications.

Microetches

TechniEtch AT-2000 is an ammonia-free, persulfate-based microetch for copper. It creates a micro roughened surface that insures optimum electrolytic copper adhesion. TechniEtch AT-2000 has a moderate copper capacity and low make-up cost, ideally suited for make- and - dump operations.

TECHNI CU 85 is an oxysulfate microetch, designed to replace sodium persulfate. It has a long bath life and can be replenished to extend the bath life. The maximum copper holding capacity is twice that of sodium persulfate resulting in less frequent bath dumps and a reduced operating cost. The surface topography after treatment is clean and free of residues that could lead to copper to copper adhesion failures. TECHNI CU 85 produces a matte, water break free surface with increased surface area that improves electroless copper adhesion to the copper panel surfaces and the copper surfaces of the innerlayer on multiplayer printed circuit boards.