Reduced Oxide Process
TECHNI PRO-BOND Reduced Black Oxide Process
This oxide process can begin with either an acid or alkaline cleaner, Techni X-CELL 318, CUPROLITE H-930 or NICLAGI 84, followed by a microetch. For optimum adhesion performance TECHNI CU 85 is the recommended etch. Alternately a peroxide - sulfuric type etch, MICROINCIDE PHP, can be used. The oxide solution, TECHNI PRO-BOND OXIDE is supplied as two components. It operated at low temperatures and produces a self limiting, black oxide coating, with a thickness ideally suited for reduction. The TECHNI PRO-BOND REDUCER is designed to eliminate pink ring and improve prepreg bonding. The REDUCER is stabilized to resist contamination and yields excellent bath life, reducing operating costs.
TECHNI PRO-BOND REDUCER has been designed to eliminate the "pink ring" problem associated with multi-layer circuit board manufacturing. This is achieved by chemically reducing copper oxide to copper metal, while retaining the crystal structure of the oxide for ultimate bond integrity.
Advantages of the process include:
- Elimination of "pink ring" and microdelamination
- Increased stack heights for drilling
- Inner-layer resistance to subsequent acid processes
- Reliability and total analytical control
- Fully stabilized
- Resistance to contamination
- Prevention of wedge-void TPH defects
| OPERATING PARAMETERS | |
|---|---|
| TECHNI PRO-BOND REDUCER A | 3.5% - 5% v/v |
| TECHNI PRO-BOND REDUCER B | 2% - 3% v/v, or maintain pH between 12-13 |
| Temperature | 86-104°F |
| Time | 3 - 5 minutes |
