Black Brown or Red Oxide
TECHNI PRO-BOND Oxide Process
- This oxide process can begin with either an acid or alkaline cleaner, Techni X-CELL 318, CUPROLITE H-930 or NICLAGI 84
, followed by a microetch. For optimum adhesion performance TECHNI CU 85 is the recommended etch. Alternately a peroxide
- sulfuric type etch, MICROINCIDE PHP, can be used. The oxide solution, TECHNI PRO-BOND OXIDE
is supplied as two components. The concentrations can be adjusted to yield the following oxide types/thickness:
- a self limiting, low temperature of operation, black oxide coating
- a brown oxide coating
- a red oxide for polyimide bonding
The TECHNI PRO-BOND OXIDE is the core of this advanced oxide process for treatment of innerlayers prior to lamination. TECHNI PRO-BOND OXIDE offers many advantages including:
- Consistency of performance
- Controllability
- Uniform oxide coverage of both 'ground-plane' and 'logic layers'
- Low operating temperature
- Flexibility - the same product can be used for various applications
| OPERATING PARAMETERS | |
|---|---|
| Concentration: | TECHNI PRO-BOND OXIDE A 45-55% v/v TECHNI PRO-BOND OXIDE B 35-45% v/v |
| Temperature: | 131°F - 149°F (55°C - 65°C) |
| Immersion Time: | 3-8 minutes |
