Oxide Alternative

New SEALBOND PLUS Process

The new SEALBOND PLUS process is designed for high volume horizontal applications. It has all the advantages of the standard SEALBOND OMB LC process PLUS these additional benefits:

High Cu loading of 40 g/L Cu metal. High Cu loading will significantly reduce the waste stream volume. SEALBOND PLUS can reduce the waste volume by 25 - 50%.
Best in Class adhesion on all high Tg materials. Typical values of 0.8 - 1.2 kg / cm2 result from a combination of excellent deposit uniformity and superior temperature resistance.
Competitive operating cost. Contact Technic to find our how much you can save today.

Multipurpose Oxide Alternative Process for Vertical or Horizontal Applications

SEALBOND OMB LC is an alternative to the conventional oxide or reduced oxide processes. The SEALBOND OMB LC is a three step process, that replaces the oxide or reduced oxide processes. The oxide alternative process develops an organo-metallic coating on the copper surfaces to eliminate copper oxidation and promote prepreg to innerlayer copper bonding. The process begins with an acid cleaner CUPROLITE H 86/1, which is followed by and alkaline treatment, REMOVER DFA 95/LC. This two step cleaning process prepares the copper surfaces and insures uniform coverage of the organo-metallic coating to the entire copper circuit trace including the side wall. The SEALBOND OMB LC does not require a predip, reducing waste. It is supplied as a ready to use concentrate and replenished along with hydrogen peroxide to maintain a consistent etch rate and organo-metallic coating deposition. The SEALBOND OMB LC process can be applied by horizontal spray or flood equipment or can be used in a standard immersion tank processes. SEALBOND OMB LC has a low copper etching requirement minimizing waste and reducing the overall process cost. SEALBOND OMB LC forms a thin light brown colored organo-metallic deposit, that is extremely uniform and that yields excellent adhesion between Cu surfaces and resin. SEALBOND OMB LC assures a high peel-strength, similar to that obtained with the black oxide process, 4 and 6 lbs/in (0.7-1 kg/cm), depending on the working temperature. More importantly, SEALBOND OMB LC improves delamination resistance when compared to standard oxide, reduced oxide and competitive oxide alternative processes. The unique coating capability of the SEALBOND OMB LC process uniformly deposits on the top and the sidewalls of the innerlayer circuit traces, significantly increasing the bonding area of the circuit trace, resulting in increased T-260 results, regardless of laminate type. Additionally, this process eliminates pink-ring. SEALBOND OMB LC is easy to operate and works at low temperature. SEALBOND OMB LC does not contain Cu complexing agents, facilitating the spent solutions' treatment.

SEALBOND OMB process benefits include:

No Chelators or Complexing Agents
- Lower waste treatment cost, easy to waste treat
No Predip Required
- Less waste is generated, easy to waste treat, short cycle
Works in vertical basket or horizontal/vertical spray or flood equipment
- Versatile operation, works in existing oxide equipment, no equipment investment required
Short Process Cycle, Low Operating Temperature
- Lower power utilization, lower cost equipment, faster throughput
Consistent Etch Rate and Uniform Color and Coverage
- Improved yields, reduced rework, no over etching, less waste is generated
100 % Coverage on Circuit Traces and Edges
- Improved delamination resistance, improved thermal cycle performance, more consistent peel strengths, improved yields
Overall Lower Operating Costs
- Improved competitive position