Laminate Adhesion Promotion

Black or brown controlled oxide solutions are used to increase the surface area of the copper circuitry on innerlayers. Additionally the use of a controlled oxide solution prevents the development of uncontrolled copper oxidation during the lamination cycle that can lead to delamination. These processes are based on highly alkaline oxidizing solutions and are typically operated at elevated temperatures. Over the past few years, oxide alternatives have been introduced that offer a number of benefits to the PWB fabricator.

The SEALBOND PLUS Oxide Alternative offers several advantages. The SEALBOND PLUS process is simple to use. The process is short and operates at a low temperature. SEALBOND PLUS will hold up to 40 g / l of copper. Optimum operation is established with feed and bleed or with our automated controllers to maintain consistent chemistry levels that produce consistent process results. The SEALBOND PLUS process will reduce operating cost, reduce wastewater used and waste treatment costs. The process results in high yields. Like reduced oxides processes, the SEALBOND PLUS process eliminates pink-ring.