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Conference Paper - Session D: Elect-ronics Finishing I (Pb-free Solder) - Tuesday morning |
A paper describing Technic Inc.'s and AMD's (Advance Micro Devices, Thailand) joint production scale evaluation, qualification and implementation of Technic's Technistan EP pure tin plating process for semiconductor devices. |
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Exhibition Hall - Booth 518 |
The MP300 continuous parts plater from Technic's Surface Finishing Technologies (SFT) Division is a single piece flow alternative to conventional rack and barrel batch processing systems. |
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Exhibition Hall - Booth 518 |
The Spouted Bed Electrode Plater (SBE) offers an alternative way of plating capacitors and chip resistors. It excells in handling very small parts while providing a more even thickness distribution than other processes. |
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Exhibition Hall - Booth 518 |
The Technic Tumbleplater is an alternative process to conventional barrel plating. Due to its gentle tumbling action, the Tumbleplater can also process some parts unsuitable for barrels. |
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Exhibition Hall - Booth 518 |
The TechnicHS Flow Cell is designed for laboratory use or as a portable test unit to simulate high speed plating applications such as reel-to-reel or lead frame plating. |
 "Bob Smith, Tony Guglielmo, Dave Eyler (click to enlarge)")
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