Technic News and Press Releases


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Technic and Stapleton enter Strategic Alliance Agreement to supply CMOS grade Autocatalytic and Immersion Processes.
Jeff Cannis to serve as new Technical Services and Facilities Manager at the Technic Anaheim facility.
Technic France has announced the purchase of Air Liquide’s semiconductor grade hydrogen peroxide operation
Technic announces the release of TechniFlex LCL 1000F, a new liquid photoimageable coverlay/solder mask for flexible circuits
Technic announces a new, patented neutral pH cleaning process for advanced electroplating applications.
Technic offers new cyanide-free silver plating process to meet environmental responsibility standards.
Andrew Fioramonti joins Technic as Global Product Manager for Solar and Wafer Level Packaging products.
Glenn Thompson joins Technic to expand accounts in Mexico and Southwest USA.
Technic announces new Immersion Silver Process for use as a solderable finish on printed circuit boards.
Technic Equipment Division announces new Table top models for lab / prototype plating.
New products in Tarniban process family, for protection of precious metal coatings
New copper process for high aspect ratio PCBs announced
Electrochemical Bath Analyzer (EBA) Announced
Technic whisker resistant Tin processes meet JEDEC criteria.
Announcement of Surface Oxiadation reduction Patent
Technic Equipment joins Aluminum Anodizers Council
Opening of New Imaging Materials manufacturing facility.
Technic Equipment Division acquires intellectual property of Plasfab Engineered Systems.
Technic purchases selected assets of Radiant Heat, Inc., a manufacturer of infrared, hot air and contact heaters and systems.
New Product - Technistan W, a lead free, high speed, pure Tin electroplating process for wire
New Product - Technistan EP, a lead free, high speed, pure Tin electroplating process
Surface Finishing Technologies (SFT) announces the SEMCON 1000, a wafer plater for university and small company R & D applications.
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