Goldeneye
Printer FriendlyProcess Chemistry and Technology for reduced gold consumption in electronic applications
Technic is pleased to offer a new line of enabling technologies designed to reduce the use of gold consumption by as much as 50%in electronic packaging and connector applications. Marketed under the name Goldeneye, this exciting new line will consists of equipment, electroplating chemistry, and ancillary process chemistries. Our Goldeneye technology encompasses newly developed barrier layers for improved component performance, gold replacement technology, and post-treatment processes aimed at reducing your overall gold consumption. The Goldeneye products offer measurable gold reduction without sacrificing the quality of the resultant finishes and are applicable in a wide range of applications.
January 2012 - Techni Nickel HT-2 provides a pure, ductile, low-stress nickel deposit with excellent thickness distribution at high current densities from a novel/proprietary electrolyte. The process is characterized by its superior throwing power, making it ideal for plating complicated connector geometries, including 3-D shapes and designs. By depositing a more uniform nickel layer underneath the gold deposit, the corrosion properties of the overall coating system are improved.
January 2012 - Techni NiPhos 611 process produces an electrodeposited nickel-phosphorous (Ni-P) alloy containing 6-11% phosphorous. The incorporation of phosphorous in the nickel deposit results in a significant improvement in the corrosion resistance of the barrier layer, which in turn enhances the corrosion resistance of the overall coating system. The deposition rate of Techni NiPhos 611 and other deposit properties are similar to that of pure nickel.
Optimal performance is obtained through use of a duplex barrier layer system consisting of pure nickel deposit from the Techni HT-2 process, followed by nickel-phosphorous electroplated from Techni NiPhos 611.
