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Technic announces the release of Pallaspeed 990

A pure Palladium deposit with high ductility and low stress for high volume connector applications


Technic has announced the release of Pallaspeed 990, a new pure Palladium electroplating process for high-volume electronic applications. Pallaspeed 990 has proven to be a highly effective process, producing a high ductility/low-stress bright deposit with no microcracking in thicknesses up to 4 µm. The process features a neutral pH with no ammonia smell and offers a wide current density range with a stable electrolyte.


The Pallaspeed 990 key characteristic is that the process incorporates a minimal amount of hydrogen during plating, which eliminates cracking of the deposit. Pallaspeed 990 is a fully analyzable process with simple UV/VIS procedures for additive control. Learn more

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New Versatile Acid Copper for High-Speed PCB Plating


Technic is pleased to announce the release of Technic CU128, a newly developed acid copper plating process for both flexible and rigid PCB applications. CU128 has proven to be especially versatile in high-speed plating operations where it is capable of achieving current densities above 10 ASD (100ASF). CU 128 is specifically formulated to double current productivity without having to invest in new Learn more


Technic Deutschland Appoints Wagner, Sales Engineer.


Technic Deutschland is pleased to announce the appointment of Gerd Wagner as Sales Engineer for the German, Austrian, and Swiss regions. Gerd will focus on the introduction and expansion of Technic products to the industrial, functional and decorative surface finishing industries and will work closely with Technic’s Italgavano Facility in Milan Italy on new product development and marketing. Learn more