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New Nickel Eliminates Boric Acid Toxicity Concerns
in Semiconductor Manufacturing

Elevate Ni 5950 – A Boric Acid Free Alternative


In response to concerns in the semiconductor industry over reports on boric acid effects on human reproduction, Technic has developed a nickel plating process free of boric acid. Elevate Ni 5950 eliminates concerns related to toxicity by offering a nickel deposit that is equal or better than a standard boric acid nickel sulfamate bath.


Technic’s Elevate Ni 5950 is capable of running at a wide current density range of 1–10 ASD. Deposit properties such as stress, ductility, tensile strength, elongation, grain structure and corrosion resistance are all very similar to a standard nickel solution.


Elevate Ni 5950 can be easily installed on existing nickel plating tools without any modifications to the plating cell. The process is Learn more

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New Versatile Acid Copper for High-Speed PCB Plating


Technic is pleased to announce the release of Technic CU128, a newly developed acid copper plating process for both flexible and rigid PCB applications. CU128 has proven to be especially versatile in high-speed plating operations where it is capable of achieving current densities above 10 ASD (100ASF). CU 128 is specifically formulated to double current productivity without having to invest in new Learn more


Technic Deutschland Appoints Wagner, Sales Engineer.


Technic Deutschland is pleased to announce the appointment of Gerd Wagner as Sales Engineer for the German, Austrian, and Swiss regions. Gerd will focus on the introduction and expansion of Technic products to the industrial, functional and decorative surface finishing industries and will work closely with Technic’s Italgavano Facility in Milan Italy on new product development and marketing. Learn more