SEMCON 3000 Wafer Plating Tool |
- System may be configured with fully automatic wafer cassette to cassette loading and unloading, or semi-automatic configuration, where wafers are manually loaded by operator into plating system. Fully automatic system can be manually loaded in the event of automation failure. System will be configured to run (1) wafer size ranging from 2-8".
- All automation and process stations are completely covered and exhausted to meet Class 10 clean room requirements. Rear of system is situated in service chase for maintenance.
- System is manufactured to meet Semi Standards S2-0200.
- System is operated from single point of use MMI where all system
parameters are set, monitored and controlled. System self-diagnostics and online help
screens provide an easy to operate tool. Process data collection is an available
option.
- Servo controlled indexing conveyor system transports wafers through the process stations providing high throughput with low maintenance. Inline system does not require wafers to be "lifted out and over" process stations. This greatly reduces chemical loss and drag-out from one process to another.
- As wafers are transported through plating process cell, which has multiple dwell positions, depositions are averaged out to provide excellent plating uniformity. Dwell times are programmable.
- System provides process station for continuous cathode contact stripping on wafer carrier to eliminate metallic build-up. This will insure long cathode connection life.
- Simplified mechanical handling system and proven chemical processes provide a stable platform for high yields with minimal downtimes.
