SMT chips with dimensions no larger than 0.25 inches (6.35 mm) in any one direction can be plated in the SBE system with a significantly reduced amount of conductive media, reducing costs and increasing production.
The unique design of the plating chamber requires no moving parts, and provides for rapid circulation of the parts over the cathode current feeder. Plating solution flow rates through the plating chamber are also exceptionally high (up to 60 liters per minute), thus ensuring that the parts are always plated in "fresh solution", irrespective of the part configuration and size. Both of these attributes result in an improved part-to-part thickness distribution and a large reduction in part-to-part coupling. The narrower thickness distribution curve will allow the SMT producer to target the average plating thickness of a given load much closer to customer minimum thickness requirements than can be done in standard barrel plating equipment. The SBE can therefore increase production speeds substantially while satisfying the most stringent quality control standards.
Another advantage of the SBE plating chamber is the complete elimination of tin and/or nickel deposits in the screened area of the chamber. Unlike a barrel, where plating takes place when the parts are on the barrel screens, the SBE screens are located in a non-plating area. This greatly cuts down on the maintenance of the plating chamber.
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