| Product | Description |
|---|---|
| Techni NuSolder JM-6000 | High speed matte tin-lead plating process with wide current density range, based on mixed acid technology. |
| Techni NuSolder JB 3200 | High speed bright tin-lead plating process with low foaming, wide current density range and mirror bright tin/lead deposit. |
| Techni NuSolder JM-6000 LS | Matte tin and tin-lead electroplating process for low speed deposition of tin, tin/lead alloys and pure lead in rack and barrel plating applications, based on mixed acid technology; 100% Sn to 5/95 Sn/Pb deposit compositions are possible. |
| Techni NuSolder JM-6000 WBP | Tin-lead plating process for wafer bump applications, with wide current density range, based on mixed acid technology; compositions available: 1%-100% tin, balance lead. |
| Techni NF Brite | Bright tin-lead MSA plating process for rack/barrel applications. 100% Sn to 80/20 Sn/Pb deposit compositions are possible. |
Chemistry Overview | Precious Metals | Non-Precious Metals | Pretreatment | Specialty | PWB | Semiconductor
Overview | Rack & Barrel | Reel-to-Reel | SFT | Catalog | Real Time Analyzer | Waste Treatment | Used & Surplus
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