Technic Pure Tin Processes

Product	Description
Technistan EP	Industry leading Pb-free pure tin whisker resistant plating process based on mixed acid technology for Pb-free electronics applications
Technistan JB 3000	High speed bright pure tin plating process with low foaming, wide current density range and mirror bright pure tin deposit.
Ceramistan BR	Neutral pH pure tin plating process, specially formulated for electroplating sensitive passive components. Can be used in conventional rack/barrel plating equipment or in Technic's SBE plating system.
Techni Matte Tin Sulfate 89T	Sulfate tin plating process with excellent throwing power and etch resistance.
Techni NuSolder JM-6000 LS	Matte tin (and tin-lead) electroplating process for low speed deposition of tin in rack and barrel plating applications, based on mixed acid technology; 100% Sn (to 5/95 Sn/Pb deposit compositions are possible).
Technistan W	High speed matte/satin pure tin electroplating process for the wire industry, based on mixed acid technology. Offers significant advantages to MSA systems in terms of sludge reduction, cost and oxide resistance.
Technistan TP	Technistan TP is a high speed tin process developed for the continuous strip and wire plating industries. The electrolyte is based on sulfuric acid, and the deposit has a lustrous matte color that is uniform in appearance throughout its very wide current density range. The process has excellent resistance to stannic tin formation, and is not affected by iron contamination, even at concentrations as high as 20 g/l. Technistan TP offers excellent solderability performance at a price significantly less than comparable MSA processes. View technical paper on process.
Technistan JM 6000	High speed matte pure tin plating process for reel-to-reel continuous strip applications based on mixed acid technology. Offers significant advantages to MSA systems in terms of sludge reduction, cost and oxide resistance.
Techni BT Bright Acid Tin	Bright sulfate tin plating process for rack/barrel applications. Excellent low CD range, uniformity and brightness.
Technistan EP-Jet	Electroplating process for extremely high speed, whisker resistant deposition of matte tin in high speed jet plating applications. Particularly recommended for 2-stage pre-plated frame (PPF) silver spot/pure tin plating applications.
Technistan EP-LS	Whisker resistant low speed matte tin electroplating process for rack and barrel plating of electronic parts.