Electroless Nickel Immersion Gold

The following table lists the Technic products for this process, not just the nickel bath.


Product Description
TechniClean AT-1000 Acid cleaner for PC applications which removes oxide, fingerprints, and stains.
TechniClean AT-1000 LF Low foaming acid cleaner for PC applications which removes oxide, fingerprints, and stains.
TechniEtch AT-2000 Ammonia-free, persulfate based microetch solution for PC applications
TechniActivator AT-3000 Acid activator for PC applications, providing uniform, smut free, adherent deposits to copper.
TechniCatalyst AT-4000 Chloride-free activator designed for complete uniform initiation of Ni reduction on copper for PC applications.
TechniENickel AT-5000 Electroless nickel process for PC applications with advanced EN-P alloy (7-10% P) formulated to minimize by-product formation and longer bath life. Uses advanced stabilizer system.
TechniIMGold AT-6000 Immersion gold process for PC applications which deposits thin pure gold onto copper or nickel substrates. High tolerance to contamination.
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