Technic Electroless Nickel

Product	Description
Techni EN 1400	Low-phosphorus electroless nickel plating process exhibiting high as-plated hardness, superior wear resistance and excellent corrosion resistance in alkaline environments. Compressively-stressed deposit.
Techni EN 2600	Self-pH regulating, medium-phosphorus electroless nickel process designed for general metal finishing applications requiring a bright nickel deposit with consistent phosphorus content. Featuring a 1:1 component addition schedule, this process is easily controlled by regular, manual additions or automated electroless nickel controller systems. Long bath lifetime on troublesome substrates such as aluminum, magnesium and zinc die cast. Especially suited for use in telecommunications applications on aluminum as base layer under our 1025 Silver Process. Meets requirements of Mil-26074B, AMS 2404B and AMS 2405 specifications.
Techni EN 3500	Self-pH regulating, high-phosphorus electroless nickel process ideally suited for applications requiring maximum corrosion resistance and non-magnetic deposit properties, such as memory discs. Convenient 1:1 addition components available, and completely compatible with all automatic electroless nickel control and replenishment systems. Meets requirements of Mil-26074B, AMS 2404B and AMS 2405 specifications.
Techni EN Strip 1700	Non-nitric acid, specialized immersion stripper designed for removal of electroless nickel deposits from a variety of base metals. Capable of completely dissolving nickel-phosphorus alloy without staining and unwanted residues on base metals.
Techni EN Zincate	Completely cyanide-free alkaline zincating process designed for use in conventional double-zincating preparation of pure and alloyed aluminum for plating with copper, nickel and electroless nickel. Proprietary inhibitors ensure thin, dense catalyzation of substrate while eliminating pitting and minimizing undesirable surface etching.
Techni SBZ Conditioner	Specialized, cyanide-free zincate ideally suited for use in catalyzation of pure aluminum on wafer pads for subsequent plating with electroless nickel. Stabilized, alkaline formulation with not pit or etch aluminum surface appreciably.