Technic Gold Tin Process - AuroStan H

AuroStan H is a plating solution formulated to deposit semi-bright to bright eutectic Gold Tin Alloy. The alloy ranges from 75 to 82-wt% Au content, with corresponding melting temperature between 280°C to 320°C. The alloy is useful in opto-electronic, semiconductor applications, for plating of larger area and as a low melting solder. The electrolyte is compatible with most photo resist systems.

Features and Benefits

1. AuroStan H deposits eutectic or near eutectic alloy from 5 to 7.5 ASF
2. Excellent electrolyte stability
3. Excellent solderability characteristics
4. Compatible with most photoresist systems