Technic Copper Processes

Product	Description
Techni FB Bright Acid Copper	General purpose acid copper for panel and pattern plating of printed circuit boards. Excellent surface-to-hole ratio, operating with a single replenishment additive on amp-hour basis.
Technic CU-2300	High throw, micro-leveling, acid copper plating process for PC applications. Two additive system. Analyzable by RTA or CVS. Tensile strength and elongation properties of deposits satisfy the requirements of MIL-P-55110-D and BS9760.
Technic CU-2800	High throw, micro-leveling, acid copper plating process for PC applications. One additive system for amp hour based replenishment. Analyzable by RTA or CVS. Specifically engineered to provide high throw without the high cost of PPR rectification. The copper deposited from the TECHNIC CU 2800 process meets all military, IPC and specific OEM requirements for purity, elongation, thermal cycle and thermal shock resistance.
Technic CU-3300	High throw, micro-leveling acid copper plating process with proprietary polarizer to enable processing of advanced board designs including HDI and microvia. Analyzable by RTA.
Techni Copper U	Bright acid copper process for decorative plating applications, exhibiting excellent leveling and brightness.
Techni Copper RR	Matte / satin copper sulfate process designed for high-speed, reel-to-reel and wire plating applications.
Techni NF Copper	High-speed matte copper utilizing methanesulfonic acid electrolyte.
TechniPulse 5300	High throw, micro-levelling acid copper plating process designed specifically for use with periodic reverse pulse rectification.