Etchants-us

TechniEtch

Advanced Metal Etchants for Semiconductor Packaging Applications


Etching is used in microfabrication to chemically remove layers from the surface of a wafer during the manufacturing process. Etching is a critically important process with every wafer undergoing many etching steps before completion.


Technic supplies a range of specialty products for each phase of production and specific application in the etch process. Technic's line of TechniEtch products provide superior results and consistently high performance.


As will all Technic products, we offer our extensive experience and unparalleled customer service that has made Technic a respected resource for quality around the globe.




TechniEtch AC35

Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals



SEM showing a TechniEtch AC35 undercut at 3µm on the left to the competitor's POR at 14µm on the right.



TechniEtch SLC

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.



SEM showing minimum Cu sidewall attack with complete Sn & alloys compatibility. On the left, TechniEtch SLC with an undercut of <1µm. On the right, a typical undercut for a competor's POR at at >5µ.



TechniEtch TBR19 (Learn More)

Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.



Detailed SEM showing Ti/Tin/TiW etchant with low undercut and high Cu, Al, Sn compatibility.SEM showing minimum Cu sidewall attack with complete Sn & alloys compatibility.



TechniEtch ACI2

Iodine based metal etchant for use with selective gold applications.


TechniEtch CN10

Copper seed layer etchant providing selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal selectivity.