Argentomerse NC - Immersion Silver

Argentomerse NC

Immersion Silver


Unlike most immersion silver processes on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 uin) of silver per minute on copper and copper alloys. Argentomerse NC is slightly alkaline and, unlike acid processes, the deposition of silver from Argentomerse NC is controlled, yielding more uniform silver thicknesses over a wide range of PCB designs. Argentomerse NC has a wide tolerance for chloride and does not require a pre-dip or DI water rinsing prior to the immersion silver bath.


Argentomerse NC utilizes a proprietary silver complex making it possible to operate at a slightly alkaline pH. Unlike acid immersion silver processes, the deposition of silver from Argentomerse NC is controlled, yielding more uniform silver thicknesses over a wide range of PCB designs. This also means no aggressive removal of copper deposits like electroless copper used in metallization or rolled annealed copper used in subtractive flexible circuit boards.


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Cleaner: TechniClean AT 1000
Micro Etch: TechniEtch AT 2000
Immersion Silver: Argentomerse NC
Post Dip: Tarniban 60


Roll-to-Roll Wet Process Technology

Electroplating for flex circuits

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