Electrolytic Nickel and Electrolytic Precious Metals

Electrolytic Nickel and Electrolytic Precious Metals



Technic Electrolytic Nickel and Gold processes have been specifically engineered to provide the widest operating window for tab or pattern plating of nickel and hard or soft gold. The individual products in the process have been specially formulated to provide the optimum metal distribution for improved throwing power and surface distribution. The gold plating processes exhibit excellent adhesion and have minimal attack on aqueous resists, increasing the operating window and allowing the chemistry to be operated with reduced gold concentrations without resist lifting.

The Technic Electrolytic Nickel and Gold processes have the following unique process benefits:

  • Superior Nickel Through-Hole Deposition
  • Consistent and Controllable Deposit Properties
  • Compatibility with Aqueous Resists
  • High Efficiency Plating with High Build Rates
  • Overall Excellent Metal Distribution

Techni Nickel HT-2

Techni Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to hole distribution and is ideally suited for use in printed wiring board applications where an increased thickness is desired inside a blind via or high aspect ratio through hole. The Techni Nickel HT-2 process deposits a low stress nickel barrier layer with excellent cosmetic and mechanical properties.


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Orosene 80RC

Orosene 80RC is the industry standard colbalt brightened acid gold process. The deposit meets the requirements for type I and II, gradeC, of ASTM B488-01. The solution is compatible with aqueous dry film and can be utilized in high speed or rack plating operations. The Orosene 80RC operates in a wide range of gold concentration making it adaptable to suit different applications. The chemistry has a high tolerance for metallic impurities and provides uniform appearance over a wide current density range


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Orosene 990HS

Orosene 990 HS is a high speed, high efficiency hard gold formulation that mini- mizes hydrogen evolution and provides improved edge adhesion on dry film resists. It has a stable and controllable electrolyte designed to produce a deposit with consistent physical and functional performance. Orosene 990 HS provides improved gold distribution, reducing operating costs. The formulation demonstrates exceptional compatibly with a wide variety of aqueous dry film photo resists. Orosene 990 HS has been engineered to provide a wide operating window for pattern plating of hard gold. The overall process will provide optimum metal distribution and adhesion while virtually eliminating attack on dry film resist. Orosene 990 HS has demonstrated high efficiency and a high build rate while maintaining consistent deposit thickness.


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Techni-Gold 434HS

Techni-Gold 434 HS is ideally suited to meet the pure soft gold requirements of wire bonding. Techni-Gold 434 HS Acid Pure Gold has been designed to produce a gold deposit that has 99.99+ % purity with a hardness of of 80-90 Knoop 25. The deposit meets Mil-G-45204C, Type III, Grade A requirements. TECHNI-Gold 434 HS is operated at 1 tr. oz. / gallon nominal, and will plate bright in a range of 1-10 ASF at 145 - 155 ° F. . The typical operation at 3 ASF with a plating time of 12-14 minutes will deposit 2.5 microns. The contact resistance is 0.3 milliohms/cm2 and the gold deposit density is 18.5 g/cc.


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